The investigations of thermal conductivity of materials are important to understand their characteristics and their influences. In simulation-based studies
many researchers used molecular dynamics (MD) simulation to analyze the thermodynamic properties. In this paper
non-equilibrium molecular dynamics (NEMD) simulations based on uniform internal heat source are performed to determine the thermal conductivity of nickel material by using Lenard-Jones potential model and EAM potential model. Simulation results based on different potential models are achieved and analyzed. Based on this
the thermal conductivity of copper and nickel-copper solid solution were simulated. The EAM potential model was further validated by achieving reasonable results for copper. And the optimized Ni-Cu ratio for lower thermal conductivity of solid solution were modeled based on the EAM model.