ZHANG Bo, WANG Yaxiong. An experimental investigation on a novel liquid thermoelectric cooling device[J]. CIESC Journal, 2014, (9): 3441-3446.DOI: 10.3969/j.issn.0438-1157.2014.09.018.
A novel liquid thermoelectric cooling device is developed and assembled for sub-ambient temperature cooling of chips in over-clocking or super calculating. A testing system was set up and experiments were conducted to investigate the thermal performance of the novel cooling device under various application conditions. Results showed that the maximum heat dissipating capacity was 45.2 W·cm-2 and the lowest total thermal resistance was 0.107℃·W-1 at case temperature of 65℃ and cooling air flowrate of 7-13 m·s-1. The case temperature of the heat source was reduced 4.0 and 4.6℃
respectively
at cooling air flowrate of 9 and 13 m·s-1
with input heat flux of 28.5 W·cm-2 and TEC at its optimum input voltage. The cooling performance of the device is also closely related with the input voltage of TEC. With the heat flux of heat source at 28.5 W·cm-2 and cooling air flowrate of 9 and 13 m·s-1
the optimum operating voltage of TEC is 28 and 32 V