TAN Jun, WANG Huajin, SHA Baoxiang, et al. Properties of biphenyl A epoxy resin modified by choromethyl polyhedral silsesquioxane[J]. CIESC Journal, 2013, (11): 4269-4273.
TAN Jun, WANG Huajin, SHA Baoxiang, et al. Properties of biphenyl A epoxy resin modified by choromethyl polyhedral silsesquioxane[J]. CIESC Journal, 2013, (11): 4269-4273.DOI: 10.3969/j.issn.0438-1157.2013.11.052.
Hybrid epoxy resin composite materials were prepared from choromethyl polyhedral silsesquioxane(CM-POSS)
bisphenol epoxy(E-51)
MeTHPA and TEA.The curing reaction of hybrid epoxy
and mechanical and thermal properties of the cured epoxy were characterized by Fourier transform infrared spectroscopy(FT-IR)
differential scanning calorimetry(DSC)
thermogravimetric analysis(TGA)and heat distortion temperature tester.CM-POSS was connected in cross-linked epoxy resin system by chemical reaction in the curing reaction process.Thermal properties
tensile
bending and impact strengthes of the cured hybrid resin were improved with increased content of CM-POSS.Addition of CM-POSS could make the Tg and rigidity of epoxy resin increase but had little effect on tenacity.