SONG Qiusheng, YAO Wei, YANG Sensen, et al. Curing kinetics and thermal properties of TG-siloxane modified BPFER/mXDA system[J]. CIESC Journal, 2013, (6): 2080-2085.
SONG Qiusheng, YAO Wei, YANG Sensen, et al. Curing kinetics and thermal properties of TG-siloxane modified BPFER/mXDA system[J]. CIESC Journal, 2013, (6): 2080-2085.DOI: 10.3969/j.issn.0438-1157.2013.06.025.
3-tetramethyl disiloxane (TG-siloxane) was synthesized by using phase transfer catalyst and was characterized with FTIR and 13C NMR. The kinetics of curing reaction for a system of bisphenol F epoxy resin (BPFER) /TG-siloxane with m-xylylenediamine (mXDA) as curing agent was monitored with differential scanning calorimetry (DSC).The apparent activation energy was obtained by the Starink equation.The kinetic parameters
such as frequency factor and the values of reaction order were obtained based on the Šesták-Berggren model.The kinetic equation suggested that the curing reaction was influenced greatly by heating rate.It was shown that the predicted reaction progress was very close to the experiment.The TG curves indicated that cured BPFER/TG-siloxane/mXDA system had better heat-resistance than that of BPFER/mXDA.