异质材料表面对小间隙通道流动沸腾特性的影响

朱禹; 陈鑫源; 王世学

doi:10.11949/j.issn.0438-1157.20260447

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异质材料表面对小间隙通道流动沸腾特性的影响

流体力学与传递现象 | 更新时间：2026-05-03

- 异质材料表面对小间隙通道流动沸腾特性的影响
- Effect of heterogeneous material surface on flow boiling characteristics in mini-gap channels
- 化工学报 2026年
- 作者机构：
  
  1.天津大学机械工程学院，天津 300350
  2.天津大学国家储能技术产教融合创新平台，天津 300350
- 作者简介：
  
  朱禹（1982—），男，博士，副教授，zhuyu@tju.edu.cn
  王世学（1964—），男，博士，教授，wangshixue_64@tju.edu.cn
- 基金信息：
- DOI：10.11949/j.issn.0438-1157.20260447
  中图分类号： TK124;TK172
- 收稿：2026-03-31，
  
  修回：2026-05-02，
  
  录用：2026-05-03，
- 稿件说明：
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朱禹, 陈鑫源, 王世学. 异质材料表面对小间隙通道流动沸腾特性的影响[J/OL]. 化工学报, 2026.

ZHU Yu, CHEN Xinyuan, WANG Shixue. Effect of heterogeneous material surface on flow boiling characteristics in mini-gap channels[J/OL]. CIESC Journal, 2026.
朱禹, 陈鑫源, 王世学. 异质材料表面对小间隙通道流动沸腾特性的影响[J/OL]. 化工学报, 2026. DOI： 10.11949/j.issn.0438-1157.20260447.

ZHU Yu, CHEN Xinyuan, WANG Shixue. Effect of heterogeneous material surface on flow boiling characteristics in mini-gap channels[J/OL]. CIESC Journal, 2026. DOI： 10.11949/j.issn.0438-1157.20260447.

摘要

在铜基底上沿流动方向平行嵌入多条环氧树脂以构建异质材料表面，实验研究了常压去离子水在小间隙通道（长54 mm、宽10 mm、高1 mm）内该表面上的流动沸腾特性，并与纯铜表面进行对比。实验工况为质量通量200–400 kg/(m

·s)，入口温度80℃。结果表明，通道内依次出现泡状流、搅拌流和环形流，且在搅拌流早期观察到流动不稳定现象。异质材料表面提前了沸腾起始点，过冷沸腾和饱和沸腾阶段其传热系数较纯铜表面分别平均提升60.1%和63.8%，但临界热通量降低9.6%。异质材料表面因不稳定流动出现压降骤增，使压降较纯铜表面平均增加79.5%，不稳定流动结束后压降较纯铜表面增加15.8%。

Abstract

Multiple epoxy resins were embedded in parallel into a copper substrate along the flow direction to construct a heterogeneous material surface. The flow boiling characteristics of deionized water at atmospheric pressure on this surface in a mini‑gap channel (54 mm long

10 mm wide

1 mm high) were experimentally investigated and compared with a pure copper surface. The experimental conditions were a mass flux of 200–400 kg/(m²·s) and an inlet temperature of 80°C. The results show that bubbly flow

churn flow and annular flow appear sequentially in the channel

with flow instability observed in the early churn flow regime. The heterogeneous material surface advances the onset of boiling. Compared with the pure copper surface

the heat transfer coefficient is enhanced by 60.1% and 63.8% on average during the subcooled and saturated boiling regimes

respectively. Meanwhile

the critical heat flux of the heterogeneous material surface is reduced by 9.56%. Due to the occurrence of flow instability

the heterogeneous surface exhibits a sharp increase in pressure drop

resulting in an average increase of 79.5% compared to the pure copper surface. After the instability subsides

the pressure drop remains 15.8% higher than that of the pure copper surface.

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