To solve the problem of heat dissipation in high heat flux electronic devices
a flat-type loop gravity heat pipe (LGHP) with upper and lower surfaces connected by a plurality of square columns is designed. An experiment was performed to study the heat transfer performance and temperature uniformity performance under different heating loads. The effect of evaporator placement and different types of working fluid on heat transfer performance also was tested. The results show that using R134a as referigerant and placing the flat plate evaporator vertically has better heat transfer performance
and the critical heat flux(CHF) can reach 212.3 kW/m2 while the heat transfer coefficient is 16.2 kW/(m2·K). This LGHP can ensure the working temperature of electronic compenents less than 60℃ and the temperature difference between each point at the flat plate evaporator wall are less than 5℃
which prove the excellent temperature uniformity performance.