LIU Lin, REN Zhengbo, SU Hongyu, et al. Inhibition behavior of self-assembled films of Schiff bases for copper[J]. CIESC Journal, 2018, (10): 4324-4334.
LIU Lin, REN Zhengbo, SU Hongyu, et al. Inhibition behavior of self-assembled films of Schiff bases for copper[J]. CIESC Journal, 2018, (10): 4324-4334.DOI: 10.11949/j.issn.0438-1157.20180005.
4-thiadiazole-4-hydroxy benzaldehyde (A) and 2-aminobenzimidazole-4-hydroxy benzaldehyde (B) were fabricated respectively on copper surface by molecular self-assembled process. The corrosion inhibition performance of the Schiff self-assembled films (SAMs) in 3% NaCl solution was examined by electrochemical methods. The results indicated that SAMs could effectively inhibit the corrosion on the copper. The best corrosion inhibition rate of Schiff base A reached to 98.9% with the concentration of 15 mmol·L-1 and assembly time of 6 h at 25℃. The best corrosion inhibition rate of Schiff base B reached to 96.73% with the concentration of 20 mmol·L-1 and assembly time of 12 h at 25℃. The surface analysis showed that a protective film on the surface of copper was formed
which effectively blocked the transfer of corrosive medium to the metal substrate. Quantitative calculation and molecular dynamics simulation were used to analyze the relationships between the molecular structure and corrosion inhibition performance of two inhibitors of A and B
and the adsorption form on copper surface. The results showed that two inhibitors had good corrosion inhibition performance. The inhibition effect of A was better than that of B
which was consistent with the experimental results.