A new structured heat pipe radiator was designed with integration of the evaporator of flat heat pipes and the condenser of finned cupper cylinders

in order to meet the new requirements of heat dissipation and uniform temperature of electrical and electronic equipment. Heat transfer experiments and simulation analysis were performed to study temperature distribution across the heat pipe under various conditions

factors influencing performance and heat transfer capacity. Results showed good temperature control across the heat pipe with difference in the range of 1.75℃. Heating power and convection heat dissipation had influence on starting performance

overall thermal resistance

equivalent thermal conductivity and heat transfer coefficient. With the increase of heating power and convection rate

both start-up time and thermal resistance were decreased whereas equivalent coefficient of thermal conductivity and coefficient of heat transfer were increased. The minimum thermal resistance and the optimal equivalent thermal conductivity of the heat pipe were 0.189℃·W-1 and 20964 W·m-1·K-1

respectively. Compared to traditional heat pipe of same dimensions

the new design had a reduction in thermal resistance by 37% and an increase in heat transfer coefficient by 15%.