1.华北电力大学低品位能源多相流与传热北京市重点实验室,北京102206
2.华北电力大学电站能量传递;转化与系统教育部重点实验室,北京102206
王宗前(2003—),男,硕士研究生,17752186533@163.com
纪献兵(1971—),男,博士,教授,jxb@ncepu.edu.cn
收稿:2026-05-08,
修回:2026-06-23,
录用:2026-07-03,
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王宗前, 纪献兵, 苑强, 等. 双亲性Janus颗粒强化池沸腾传热研究[J/OL]. 化工学报, 2026.
WANG Zongqian, JI Xianbing, YUAN Qiang, et al. Pool boiling heat transfer enhancement by amphiphilic Janus particles[J/OL]. CIESC Journal, 2026.
王宗前, 纪献兵, 苑强, 等. 双亲性Janus颗粒强化池沸腾传热研究[J/OL]. 化工学报, 2026. DOI: 10.11949/0438-1157.20260640.
WANG Zongqian, JI Xianbing, YUAN Qiang, et al. Pool boiling heat transfer enhancement by amphiphilic Janus particles[J/OL]. CIESC Journal, 2026. DOI: 10.11949/0438-1157.20260640.
为进一步提升池沸腾传热性能,将双亲性Janus颗粒引入池沸腾体系。制备了不同粒径尺度的双亲性Janus颗粒,研究了Janus颗粒的堆积层数和不同粒径颗粒组合对池沸腾传热性能的影响。结果表明,2层毫米级颗粒与0.2 wt.%纳米颗粒组合的强化效果最佳,临界热通量达244.3 W·cm
-2
,传热系数达250.6 kW·m
-2
·K
-1
,较光滑表面分别提升117.7%和149.9%。强化机理在于:Janus颗粒的疏水侧降低了气泡成核能垒,促进气泡生成与脱离,从而强化传热系数;亲水侧凭借亲液特性促进液体向蒸发区域回流,从而提高临界热通量。本研究为高功率电子器件的先进热管理提供了新思路与实验依据。
To enhance the pool boiling heat transfer performance
amphiphilic Janus particles were introduced into the pool boiling system. Amphiphilic Janus particles with different particle sizes were prepared
and the effects of the stacking layer number of Janus particles and t
he combination of particles with different sizes on pool boiling heat transfer performance were investigated. The results showed that the combination of two layers of millimeter-sized particles and 0.2 wt.% nanoparticles exhibited the best enhancement effect
achieving a critical heat flux of 244.3 W·cm
-2
and a heat transfer coefficient of 250.6 kW·m
-2
·K
-1
which were 117.7% and 149.9% higher than those of a smooth surface
respectively. The enhancement mechanism lies in that the hydrophobic side of Janus particles reduces the bubble nucleation energy barrier and promotes bubble generation and departure
thereby enhancing the heat transfer coefficient; meanwhile
the hydrophilic side facilitates liquid reflux to the evaporation region due to its lyophilic property
thus increasing the critical heat flux. This study provides a new idea and experimental basis for advanced thermal management of high-power electronic devices.
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