A novel heat released microcapsule-type latent curing agent was prepared by solvent evaporation technique with 2-methylimidazole(2MMZ)as core material and polystyrene(PS)as wall material.The chemical structure

core material content

surface morphology

size distribution and curing characteristics of this microcapsule-type curing agent were characterized by FT-IR

TGA

SEM

granulometer and DSC.The obtained microcapsules had a smooth surface and displayed a narrow size distribution with the mean size about 10.18 μm

and its core material content was about 40.36%.In addition

the one-component adhesive made from the microcapsules and epoxy resin E-51 showed excellent curing characteristics and latent properties.It was found that the E-51/2MMZ-PS microcapsule system could be cured at 100℃ in 1 h and its shelf life at room temperature was more than 1 month.