A model for predicting the plating thickness during the citrate alkaline electroplating process was proposed. It was based on the relationships between the coating thickness of copper and electroplating time at different current densities in a given citrate alkaline medium. The results showed a good agreement between the coating thickness data predicted by the present model and the data measured experimentally. Based on the model

an equation was established for calculating the current efficiencies during the process. Such data would be valuable for the process control and optimization during citrate alkaline copper-electroplating.