The non-metallic powder recycled from waste paper-based printed circuit boards (PCBs) was analyzed with scanning electron microscopy (SEC)

X-ray fluorescence (XRF)

Fourier transform infrared spectrum (FTIR)

and the mechanical properties

heat resistance of the non-metallic powder filled polypropylene (PP) composites were tested. The properties of non-metallic powder recycled from waste paper-based PCBs and its effect on the performance of the composites were studied. The results showed that the waste paper-based PCBs was resin polymer with a little fiberglass

and its polarity was due to the presence of hydroxide groups

carbonyl groups

acetal groups and silanol groups on the particle surface. Modified non-metallic powder and PP powder in the composite exhibited excellent compatibility

and modified non-metallic powder enhanced the bending strength

Vicat softening temperature (VST) and flame retardance capability of the composite. The bending strength of the composite increased with increasing filler proportion of the nonmetal powder

bending strength increased by 9.1 MPa and VST rose by 2℃ when the 0.08 cm（180 mesh） non-metallic powder filler proportion reached 30%. The non-metallic powder could be used as filler in the PP composite to improve the properties of the composite.