LAI Yanhua, WU Tao, WEI Lulu, et al. Thermal performance of electronic components based on phase change materials[J]. CIESC Journal, 2014, (S1): 157-161.
DOI:
LAI Yanhua, WU Tao, WEI Lulu, et al. Thermal performance of electronic components based on phase change materials[J]. CIESC Journal, 2014, (S1): 157-161.DOI: 10.3969/j.issn.0438-1157.2014.z1.025.
Thermal performance of electronic components based on phase change materials
A comparison was made among the thermal manage performance of electronic components based on radiator with three different kinds of material filling state
without paraffin
pure paraffin
composite of graphite with paraffin. The surface temperature of electronic component substrate and radiator during input power changes were tested by experiment. The results indicated that paraffin and composite of graphite with paraffin can shorten the time for electronic components reaching steady state. Temperature change rates declined. While the power increased abruptly
temperature between radiators and chips rose smaller and smoother when filled with paraffin and composite of graphite with paraffin
resulting in effectively restrain the adverse effects of heat shock on electronic components. In cooling process
the surface temperature of radiator filled with paraffin
composite of graphite with paraffin changed smoother
which was beneficial to extending the service life of radiator.
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