Preparation and curing reaction kinetics of liquid vinyl silicone resin

LIU Huijuan; ZHAN Xibing; ZHU Wenqin; LIN Xin; CHENG Jue; ZHANG Junying

doi:10.3969/j.issn.0438-1157.2014.04.048

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Preparation and curing reaction kinetics of liquid vinyl silicone resin

更新时间：2025-12-10

- Preparation and curing reaction kinetics of liquid vinyl silicone resin
- CIESC Journal Issue 4, Pages: 1509-1516(2014)
- 作者机构：
  
  1. 北京化工大学教育部碳纤维及功能高分子教育部重点实验室,北京,100029
  2. 北京化工大学常州先进材料研究院,江苏,常州,213164
- 作者简介：
- 基金信息：
- DOI：10.3969/j.issn.0438-1157.2014.04.048
  CLC： Q320.1
- Online First：27 November 2013，
  
  Published：27 November 2013
- 稿件说明：
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LIU Huijuan, ZHAN Xibing, ZHU Wenqin, et al. Preparation and curing reaction kinetics of liquid vinyl silicone resin[J]. CIESC Journal, 2014, (4): 1509-1516.
DOI：

LIU Huijuan, ZHAN Xibing, ZHU Wenqin, et al. Preparation and curing reaction kinetics of liquid vinyl silicone resin[J]. CIESC Journal, 2014, (4): 1509-1516. DOI： 10.3969/j.issn.0438-1157.2014.04.048.

摘要

合成了一种液体乙烯基硅树脂，并用FT-IR、GPC、1H NMR和29Si NMR等手段对其结构进行表征。采用非等温差示扫描量热法（DSC）研究了乙烯基硅树脂/苯基含氢硅油体系的固化反应动力学，用Kissinger方程和高级等转化率法（Vyazovkin方法）分别计算了该体系的表观活化能Ea，用Málek法进行模型拟合动力学分析，通过T-β外推法确定该体系的固化工艺参数。结果表明：Kissinger法和Vyazovkin法得到的活化能分别为85.3 kJ·mol-1和84.0 kJ·mol-1，二者所得结果的差别较小；乙烯基硅树脂体系固化动力学符合Šesták-Berggren（m，n）模型，m和n分别为0.092、1.440，拟合曲线与实验的DSC曲线吻合；该树脂体系的近似凝胶化温度为89.1℃，固化温度为127.8℃，后处理温度157.6℃。

Abstract

A liquid vinyl silicone resin was prepared. Its structure was confirmed by FT-IR

GPC

1H NMR

29Si NMR. The curing kinetics of vinyl silicone resin/ phenyl hydrogen silicone oil system was studied by isothermal DSC. The activation energy of this system was obtained by the Kissinger method and advanced iso-conversional method proposed by Vyazovkin. The non-isothermal reaction kinetics was investigated based on the model-fitting Málek method. The curing parameters were obtained by the T-b extrapolation method. The results showed that the apparent activation energies of the curing reaction were 85.3 kJ·mol-1 and 84.0 kJ·mol-1 calculated by Kissinger method and Vyazovkin method

respectively. The Šesták-Berggren(m

n) model was found to be appropriate to describe the curing kinetics of the studied silicone resin system and the theoretically calculated curve agreed well with the experimental data. The characteristic temperatures of the resin system were approximate gelling temperature of 89.1℃

curing temperature of 127.8℃

and post-processing temperature of 157.6℃.

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