LIU Xiaodong, CHENG Jue, LIN Xin, et al. Curing kinetics of epoxy resins/amine system and epoxy/episulfide resin/amine system[J]. CIESC Journal, 2013, (11): 4046-4053.
DOI:
LIU Xiaodong, CHENG Jue, LIN Xin, et al. Curing kinetics of epoxy resins/amine system and epoxy/episulfide resin/amine system[J]. CIESC Journal, 2013, (11): 4046-4053.DOI: 10.3969/j.issn.0438-1157.2013.11.022.
Curing kinetics of epoxy resins/amine system and epoxy/episulfide resin/amine system
The curing kinetics of a low viscosity epoxy resin system CY184/IPDA and an epoxy-episulfide resin system CY184/ES184/IPDA were studied by non-isothermal DSC.An advanced isoconversional method proposed by Vyazovkin was used to solve the activation energy of these resin systems.Based on the Málek method
curing mechanism functions and reaction kinetic parameters were obtained and the curing kinetic equations of these systems were determined.Average activation energy values for CY184/IPDA and CY184/ES184/IPDA epoxy/episulfide resin system were 47.04 kJ·mol-1 and 48.97 kJ·mol-1 respectively.The calculated curves fitted well with experimental DSC curves of these systems which could be described by Šesták-Berggren(m