Structure and appearance of double electroless Ni-P/Ni-Cu-P plating of Kevlar fibers

FANG Dongsheng; SUN Yong; DUAN Yonghua; GUO Zhongzheng; FAN Zhuozhi

doi:10.3969/j.issn.0438-1157.2012.12.038

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Structure and appearance of double electroless Ni-P/Ni-Cu-P plating of Kevlar fibers

更新时间：2025-12-10

- Structure and appearance of double electroless Ni-P/Ni-Cu-P plating of Kevlar fibers
- CIESC Journal Issue 12, Pages: 4003-4009(2012)
- 作者机构：
  
  昆明理工大学材料科学与工程学院,云南,昆明,650093
- 作者简介：
- 基金信息：
- DOI：10.3969/j.issn.0438-1157.2012.12.038
  CLC： Q153
- Online First：09 August 2012，
  
  Published：09 August 2012
- 稿件说明：
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FANG Dongsheng, SUN Yong, DUAN Yonghua, et al. Structure and appearance of double electroless Ni-P/Ni-Cu-P plating of Kevlar fibers[J]. CIESC Journal, 2012, (12): 4003-4009.
DOI：

FANG Dongsheng, SUN Yong, DUAN Yonghua, et al. Structure and appearance of double electroless Ni-P/Ni-Cu-P plating of Kevlar fibers[J]. CIESC Journal, 2012, (12): 4003-4009. DOI： 10.3969/j.issn.0438-1157.2012.12.038.

摘要

采用化学镀技术

实现了芳纶纤维表面化学镀Ni-P/Ni-Cu-P的金属化处理

利用SEM、EDS和XRD分别对芳纶纤维原始样品、粗化后、施镀后及剥落层的表面形貌、镀层的成分和物相进行了分析比较

并对镀层的形成机制及剥落原因进行了分析研究。结果表明:经过预处理的芳纶纤维比表面积增大

增加了其亲水性和活性;化学镀Ni-P/Ni-Cu-P后

Ni-P镀层中镍含量降低

磷含量增多

纯镍转化为Ni3P且伴随有少量的铜的出现

整体镀层中Ni、Cu、P的原子比为8.54:3.66:5.59

镀层中以纯Cu、Cu3P和Ni3P为主;另外由于镀层中应力分布不均

以及P在Ni-P/Ni-Cu-P相界面的偏聚

削弱了界面的结合强度

使局部拉应力集中

造成了镀层的剥落;且化学镀铜是依靠镍离子的催化作用形成镀层的。

Abstract

The coating of Ni-P/Ni-Cu-P on the surface of Kevlar fiber was achieved by electroless plating. The surface appearance and composition of original sample

coarsened sample

plated sample and spalled coating were investigated and compared by means of SEM

EDS and XRD.In addition

the formation mechanism and spalling reason of the coating was studied.The results showed that the Kevlar fiber specific surface area

hydrophilicity and activity increased after chemical pretreatment.After chemical Ni-P/Ni-Cu-P plating

the content of Ni in Ni-P coating decreased

however

the content of P increased

Ni was transformed into Ni3P and a little Cu was discovered in Ni-P coating.The atomic proportions of Ni

P in overall coating were 8.54:3.66:5.59

the phase of the coating mostly consisted of Cu

Cu3P and Ni3P.Because the stress of coating distributed unequally and P gathered partly in Ni-P/Ni-Cu-P phase interface

the interface bonding strength was weakened and local stress concentration occurred

which appeared to be the reason for spalling of the coating.The chemical Cu plating relied on the catalytic action of nickel ions

which helped deposition of copper ions to form the coating.

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