Synthesis, characterization and non-isothermal curing kinetics of tri-propargyl isocyanurate

陈苏锋

doi:10.3969/j.issn.0438-1157.2012.07.013

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Synthesis, characterization and non-isothermal curing kinetics of tri-propargyl isocyanurate

更新时间：2025-12-10

- Synthesis, characterization and non-isothermal curing kinetics of tri-propargyl isocyanurate
- CIESC Journal Issue 7, Pages: 2085-2091(2012)
- 作者机构：
  
  合肥工业大学化工学院
- 作者简介：
- 基金信息：
- DOI：10.3969/j.issn.0438-1157.2012.07.013
  CLC： Q323.9
- Online First：05 July 2012，
  
  Published：05 July 2012
- 稿件说明：
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陈苏锋. Synthesis, characterization and non-isothermal curing kinetics of tri-propargyl isocyanurate[J]. CIESC Journal, 2012, (7): 2085-2091.
DOI：

陈苏锋. Synthesis, characterization and non-isothermal curing kinetics of tri-propargyl isocyanurate[J]. CIESC Journal, 2012, (7): 2085-2091. DOI： 10.3969/j.issn.0438-1157.2012.07.013.

摘要

以3-溴丙炔、异氰尿酸为原料

利用相转移催化剂合成了三炔丙基异氰尿酸酯(TPIC)，并用FT-IR、1H NMR对其结构进行了表征。用TGA表征了热固化后的TPIC的热性能。结果表明：热固化后的树脂在375℃开始分解，800℃的残炭率达75%。根据DSC曲线，TPIC的熔点为167℃左右，并用Kissinger、Flynn-Wall-Ozawa和Friedman-Reich-Levi法分别计算了热固化反应活化能，它们分别为46.81、48.70和40.92 kJ·mol-1，热固化反应级数都接近1，并探讨了固化反应过程与机理。通过对比分析表明，这3种方法均适用于TPIC体系。

Abstract

Tri-propargyl isocyanurate (TPIC)was synthesized using isocyanurate and propargyl bromide by phase transfer catalyst reaction.The chemical structure of TPIC was characterized by FT-IR

1H NMR. The analysis of TGA curve referred to the cured TPIC displayed that the preliminary thermal decomposition temperature of cured TPIC was about 375℃ and the char yield was 75% at 800℃.According to DSC curves used to investigate the thermal curing behavior of TPIC

the curing kinetic parameters were calculated by several thermo analysis methods

respectively

such as Kissinger

Flynn-Wall-Ozawa and Friedman-Reich-Levi

and the apparent activation energy was 46.81

48.70 and 40.92 kJ·mol-1 respectively. The order of curing reaction obtained by the three methods all approached 1 and the mechanism was further discussed.Based on comparative analysis of the above three methods

they all can properly simulate the thermal curing process of TPIC.

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