Novel flat plate evaporator of loop gravity assisted heat pipe for high heat flux electronic cooling

LIANG Lingjiao; LIU Jinping; XU Xiongwen

doi:10.11949/j.issn.0438-1157.20180421

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Novel flat plate evaporator of loop gravity assisted heat pipe for high heat flux electronic cooling

更新时间：2025-12-10

- Novel flat plate evaporator of loop gravity assisted heat pipe for high heat flux electronic cooling
- CIESC Journal Issue 10, Pages: 4231-4238(2018)
- 作者机构：
  
  1. 华南理工大学电力学院,广东,广州,510640
  2. 广东省能源高效清洁利用重点实验室,广东,广州,510640
  3. 亚热带建筑科学国家重点实验室,广东,广州,510640
- 作者简介：
- 基金信息：
- DOI：10.11949/j.issn.0438-1157.20180421
  CLC： K124
- Online First：05 October 2018，
  
  Published：05 October 2018
- 稿件说明：
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LIANG Lingjiao, LIU Jinping, XU Xiongwen. Novel flat plate evaporator of loop gravity assisted heat pipe for high heat flux electronic cooling[J]. CIESC Journal, 2018, (10): 4231-4238.
DOI：

LIANG Lingjiao, LIU Jinping, XU Xiongwen. Novel flat plate evaporator of loop gravity assisted heat pipe for high heat flux electronic cooling[J]. CIESC Journal, 2018, (10): 4231-4238. DOI： 10.11949/j.issn.0438-1157.20180421.

摘要

为解决高热通量电子设备散热问题，设计一套蒸发器上下表面由多个方柱相连的平板型环路重力热管（LGHP）。通过实验研究其换热性能，包括在不同加热功率下平板热管的传热特性及均温特性，以及蒸发器摆放方式和不同种工质对平板热管传热性能的影响。实验结果表明，环路热管工质采用R134a的工作性能比R600a好，平板竖直放置比水平放置好。采用R134a且竖直放置时，其临界热通量（CHF）可达212.3 kW/m2，对应传热系数为16.2 kW/（m2·K）。该平板换热器可以保证电子设备工作温度不超过60℃，且运行过程中平板蒸发器与热源接触的壁面各测点间除出口处外温度差值小于5℃，均温性能优异。

Abstract

To solve the problem of heat dissipation in high heat flux electronic devices

a flat-type loop gravity heat pipe (LGHP) with upper and lower surfaces connected by a plurality of square columns is designed. An experiment was performed to study the heat transfer performance and temperature uniformity performance under different heating loads. The effect of evaporator placement and different types of working fluid on heat transfer performance also was tested. The results show that using R134a as referigerant and placing the flat plate evaporator vertically has better heat transfer performance

and the critical heat flux(CHF) can reach 212.3 kW/m2 while the heat transfer coefficient is 16.2 kW/(m2·K). This LGHP can ensure the working temperature of electronic compenents less than 60℃ and the temperature difference between each point at the flat plate evaporator wall are less than 5℃

which prove the excellent temperature uniformity performance.

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