Inhibition behavior of self-assembled films of Schiff bases for copper

LIU Lin; REN Zhengbo; SU Hongyu; ZHANG Qian; QIAN Jianhua

doi:10.11949/j.issn.0438-1157.20180005

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Inhibition behavior of self-assembled films of Schiff bases for copper

更新时间：2025-12-10

- Inhibition behavior of self-assembled films of Schiff bases for copper
- CIESC Journal Issue 10, Pages: 4324-4334(2018)
- 作者机构：
  
  1. 渤海大学化学化工学院,辽宁,锦州,121013
  2. 中国科学研究院大连物理化学研究所分子反应动力学国家重点实验室,辽宁,大连,116023
- 作者简介：
- 基金信息：
- DOI：10.11949/j.issn.0438-1157.20180005
  CLC： G174
- Online First：05 October 2018，
  
  Published：05 October 2018
- 稿件说明：
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LIU Lin, REN Zhengbo, SU Hongyu, et al. Inhibition behavior of self-assembled films of Schiff bases for copper[J]. CIESC Journal, 2018, (10): 4324-4334.
DOI：

LIU Lin, REN Zhengbo, SU Hongyu, et al. Inhibition behavior of self-assembled films of Schiff bases for copper[J]. CIESC Journal, 2018, (10): 4324-4334. DOI： 10.11949/j.issn.0438-1157.20180005.

摘要

通过分子自组装技术在铜表面制备2-氨基-5-巯基-1，3，4-噻二唑缩对羟基苯甲醛（简称A）和2-氨基苯并咪唑缩对羟基苯甲醛（简称B）缓蚀膜。采用电化学测试方法研究了两种席夫碱自组装膜在质量分数为3%的NaCl溶液中对铜的缓蚀作用。结果表明，自组装分子膜能有效抑制铜片的腐蚀，对于席夫碱A，当溶液浓度为15 mmol·L-1，组装时间为6 h时缓蚀效果最佳；对于席夫碱B，当溶液浓度为20 mmol·L-1，组装时间为12 h时缓蚀效果最佳，A、B的缓蚀效率分别达到98.9%和96.73%。表面分析技术表明，席夫碱化合物在铜表面形成一层保护膜，有效阻挡了腐蚀粒子向金属基底的转移，从而抑制了腐蚀的发生。量化计算和分子动力学模拟分析了A、B两种缓蚀剂分子构型与缓蚀性能的关系以及在铜表面的吸附形态，结果表明，两种缓蚀剂具有很好的缓蚀性能，且缓蚀效果A>B，与实验结果一致。

Abstract

Monolayer films of 2-amino-5-mercapto-1

4-thiadiazole-4-hydroxy benzaldehyde (A) and 2-aminobenzimidazole-4-hydroxy benzaldehyde (B) were fabricated respectively on copper surface by molecular self-assembled process. The corrosion inhibition performance of the Schiff self-assembled films (SAMs) in 3% NaCl solution was examined by electrochemical methods. The results indicated that SAMs could effectively inhibit the corrosion on the copper. The best corrosion inhibition rate of Schiff base A reached to 98.9% with the concentration of 15 mmol·L-1 and assembly time of 6 h at 25℃. The best corrosion inhibition rate of Schiff base B reached to 96.73% with the concentration of 20 mmol·L-1 and assembly time of 12 h at 25℃. The surface analysis showed that a protective film on the surface of copper was formed

which effectively blocked the transfer of corrosive medium to the metal substrate. Quantitative calculation and molecular dynamics simulation were used to analyze the relationships between the molecular structure and corrosion inhibition performance of two inhibitors of A and B

and the adsorption form on copper surface. The results showed that two inhibitors had good corrosion inhibition performance. The inhibition effect of A was better than that of B

which was consistent with the experimental results.

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