Thermal conductivity and contact resistance measurements for thermal interface materials

YUAN Chao; DUAN Bin; LI Lan; LUO Xiaobing

doi:10.11949/j.issn.0438-1157.20150273

您当前的位置：

首页 >

文章列表页 >

Thermal conductivity and contact resistance measurements for thermal interface materials

更新时间：2025-12-10

- Thermal conductivity and contact resistance measurements for thermal interface materials
- CIESC Journal Issue S1, Pages: 349-353(2015)
- 作者机构：
  
  华中科技大学能源与动力工程学院,湖北,武汉,430074
- 作者简介：
- 基金信息：
- DOI：10.11949/j.issn.0438-1157.20150273
  CLC： K121
- Online First：30 June 2015，
  
  Published：30 June 2015
- 稿件说明：
移动端阅览
YUAN Chao, DUAN Bin, LI Lan, et al. Thermal conductivity and contact resistance measurements for thermal interface materials[J]. CIESC Journal, 2015, (S1): 349-353.
DOI：

YUAN Chao, DUAN Bin, LI Lan, et al. Thermal conductivity and contact resistance measurements for thermal interface materials[J]. CIESC Journal, 2015, (S1): 349-353. DOI： 10.11949/j.issn.0438-1157.20150273.

摘要

热界面材料通常用于降低电子器件中固体界面的热阻。热界面材料的性质

如热导率、界面材料与固体表面间的接触热阻

对于电子器件的散热分析非常重要。然而

这些参数通常难以获得。依据ASTM D-5470测试标准

搭建了一个热界面测试系统。通过该系统测试了硅油和导热硅脂的热导率

以及它们与固体基板间的接触热阻。经分析

测试热导率和接触热阻的相对误差分别小于11.3%和41.3%。

Abstract

Thermal interface materials (TIMs) are generally used to reduce the thermal resistance between contacting surfaces in electronic devices. The thermal properties of these materials

such as thermal conductivity (kTIM) and contact resistance (Rc) at the TIM-solid interface

are critical to the heat dissipation analysis. However

it is much difficult to obtain these data. In this paper

an experimental apparatus for TIMs thermal properties measurements is built based on ASTM test standard D-5470. Using this apparatus

kTIM and Rc of the silicone oil and thermal greases are measured

respectively. According to the error analysis

the relative errors in the measurement of kTIM and Rc are less than 11.3% and 41.3%

respectively.

关键词

Keywords

references

Views

357

下载量

CSCD

Alert me when the article has been cited

提交

Tools

Publicity Resources

Analysis and experiments of measuring thermal conductivity and diffusivity of materials by plane source-pulse transient method

Determination of interaction force between droplet and solid surface using droplet probe

Thermal conductivity measurement of hydrate based on TDTR technology

Impact of torsional function on thermal conductivity of polyethylene chains

Interfacial thermal resistance in mesoporous composites and its thermal conductivity

Related Author

Fan YU

Xinxin ZHANG

Wenjie LAN

Xiaojie HU

Dizong CAI

Zhongyin ZHANG

Chengyang YUAN

Xuanhui FAN

Related Institution

School of Energy & Environmental Engineering, University of Science and Technology Beijing

State Key Laboratory of Heavy Oil Processing, China University of Petroleum

Key Laboratory of Ocean Energy Utilization and Energy Conservation of Ministry of Education, Dalian University of Technology

School of Power Engineering, Chongqing University

School of Mechanical Engineering, University of Science and Technology Beijing

⁰