Latent curing of polybiguanide/epoxy resin

WANG Quan; SHI Tiejun; ZHANG Yan; YU Fu; LIU Jianhua

doi:10.11949/j.issn.0438-1157.20140904

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Latent curing of polybiguanide/epoxy resin

更新时间：2025-12-10

- Latent curing of polybiguanide/epoxy resin
- CIESC Journal Issue 1, Pages: 464-470(2015)
- 作者机构：
  
  合肥工业大学化工学院,安徽,合肥,230009
- 作者简介：
- 基金信息：
- DOI：10.11949/j.issn.0438-1157.20140904
  CLC： 631
- Online First：05 January 2015，
  
  Published：05 January 2015
- 稿件说明：
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WANG Quan, SHI Tiejun, ZHANG Yan, et al. Latent curing of polybiguanide/epoxy resin[J]. CIESC Journal, 2015, (1): 464-470.
DOI：

WANG Quan, SHI Tiejun, ZHANG Yan, et al. Latent curing of polybiguanide/epoxy resin[J]. CIESC Journal, 2015, (1): 464-470. DOI： 10.11949/j.issn.0438-1157.20140904.

摘要

用己二胺与双氰胺熔融缩聚

合成了一种新型潜伏性环氧树脂固化剂

并研究了其与环氧树脂的固化过程。用FTIR、XPS、1H NMR分析了固化剂的结构;用DSC分析得到了固化剂与环氧树脂的适宜配比、固化体系的适宜固化温度及固化动力学参数;通过XRD分析了固化物的相结构;通过TG分析了固化物的热稳定性。结果表明

与双氰胺环氧树脂固化体系相比

固化温度降低近70℃

同时潜伏性能良好

30 d内固化度少于10%

热稳定性能良好

热分解温度超过300℃。

Abstract

A new latent curing agent for epoxy resin was synthesized via melted polycondensation of dicyandiamide (DICY) and hexamethylenediamine. The structure of the curing agent was analyzed with FTIR

XPS

1H NMR. The optimum ratio

suitable curing temperature and curing kinetic parameters of this epoxy resin curing system were studied with DSC. The phase structure of the cured epoxy resin was investigated with XRD. The thermostability of the cured epoxy resin was obtained by TG. Comparing with the DICY/EP curing system

curing temperature dropped by nearly 70℃. Latency performance was fine as curing degree was less than 10% within 30 days. Thermostability was nice as thermal decomposition temperature exceeded 300℃.

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