ZHANG Li, WANG Xinyu, LI Zheng, GU Junfeng, RUAN Shilun, SHEN Changyu. Prediction study on bond strength and modulus of fused deposition modeling product[J]. CIESC Journal, 2019, 70(7): 2727-2736
ZHANG Li, WANG Xinyu, LI Zheng, GU Junfeng, RUAN Shilun, SHEN Changyu. Prediction study on bond strength and modulus of fused deposition modeling product[J]. CIESC Journal, 2019, 70(7): 2727-2736DOI: 10.11949/0438-1157.20190155.
Prediction study on bond strength and modulus of fused deposition modeling product
A diffusion repatr model for the predicting bond strength between layers of fused deposition modeling (FDM) is introduced. The temperature-dependent diffusion model was determined based on the rheological data. The diffusion between the layers of the FDM components was predicted based on one-dimensional transient thermal analysis. The diffusion coefficient of temperature history was integrated with time to obtain the total diffusion of interfacial molecules
and then the interlaminar bond strength prediction model was obtained. The results showed that the predicted bond strength is in good agreement with the measured data under different printing conditions
which indicates that the prediction model is reasonable. Finally
the usability of the model is verified by a combination of three-point bending experiments and numerical simulations. Therefore
it can be used as an effective model for predicting the performance of FDM prints.
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