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A model for predicting plating thickness during citrate alkaline copper-electroplating process
更新时间:2025-12-10
    • A model for predicting plating thickness during citrate alkaline copper-electroplating process

    • CIESC Journal   Issue 11, (2010)
    • Online First:05 November 2010,

      Published:05 November 2010

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  • 付丽敏. A model for predicting plating thickness during citrate alkaline copper-electroplating process[J]. CIESC Journal, 2010, (11). DOI:

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