Thermosyphon cooling is a promising cooling technique for electronic device with increasing heat generation

in which heat is transferred from evaporator to condenser with a relatively small temperature difference.Two types of thermosyphon radiators with different structures on condensation sections were developed.One thicker or seven thinner thermosyphon pipes were used respectively in the condensation sections

and flat plate volume evaporators were used in both types.A testing system for the characteristics of radiators was established.Based on the method of simulating electronic device with a heated copper block

the surface temperature of the copper block at different heating powers and different wind speeds was tested in the wind tunnel

and a comparison of total thermal resistance and equivalent convection heat transfer coefficient for radiators was made.The result showed that the two radiators could both meet a cooling demand below 78.47 W.The radiator with seven thinner thermosyphon pipes had stronger heat transfer capability

because heat was dispersed by all of the seven thermosyphon pipes

which enhanced the heat transfer efficiency of heat sink.