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STUDIES ON RELATION BETWEEN STRUCTURE OF ORGANIC ADDITIVES AND THEIR LEVELING PROPERTY FOR Ni ELECTROPLATING
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    • STUDIES ON RELATION BETWEEN STRUCTURE OF ORGANIC ADDITIVES AND THEIR LEVELING PROPERTY FOR Ni ELECTROPLATING

    • CIESC Journal   Issue 5, (1994)
    • CLC: Q153
    • Online First:25 October 1994,

      Published:25 October 1994

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  • 罗明道, 陈永言, 颜肖慈, et al. STUDIES ON RELATION BETWEEN STRUCTURE OF ORGANIC ADDITIVES AND THEIR LEVELING PROPERTY FOR Ni ELECTROPLATING[J]. CIESC Journal, 1994, (5). DOI:

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