STUDIES ON RELATION BETWEEN STRUCTURE OF ORGANIC ADDITIVES AND THEIR LEVELING PROPERTY FOR Ni ELECTROPLATING
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STUDIES ON RELATION BETWEEN STRUCTURE OF ORGANIC ADDITIVES AND THEIR LEVELING PROPERTY FOR Ni ELECTROPLATING
CIESC JournalIssue 5, (1994)
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DOI:
CLC:Q153
Online First:25 October 1994,
Published:25 October 1994
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罗明道, 陈永言, 颜肖慈, et al. STUDIES ON RELATION BETWEEN STRUCTURE OF ORGANIC ADDITIVES AND THEIR LEVELING PROPERTY FOR Ni ELECTROPLATING[J]. CIESC Journal, 1994, (5).
DOI:
罗明道, 陈永言, 颜肖慈, et al. STUDIES ON RELATION BETWEEN STRUCTURE OF ORGANIC ADDITIVES AND THEIR LEVELING PROPERTY FOR Ni ELECTROPLATING[J]. CIESC Journal, 1994, (5).DOI:
STUDIES ON RELATION BETWEEN STRUCTURE OF ORGANIC ADDITIVES AND THEIR LEVELING PROPERTY FOR Ni ELECTROPLATING
The orbital energies and the charge densities of additive molecules 1
4-butanediol
2 - butyne -1
4- diol
2 - butene-1
4 - diol
nicotinamide
isonicotinamide and quinoline etc. for Ni electroplating were calculated with CNDO/2 method. It was found that there is a correlation between the frontier orbital energies of these molecules and there leveling property. The adsorption model and leveling mechanism were studied. According to orbital symmetry
the adsorptive bonding type of the additives on Ni surface was discussed. In addition
the molecules of oxalicacid and 1
4 -butane diacid were calculated which are predicted to have good leveling and proved by experiments.