Numerical investigation of electronic thermal control unit with foam composite phase change material

WU Bin; XING Yuming; XU Weiqiang

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Numerical investigation of electronic thermal control unit with foam composite phase change material

更新时间：2025-12-10

- Numerical investigation of electronic thermal control unit with foam composite phase change material
- CIESC Journal Issue 10, Pages: 2540-2545(2010)
- 作者机构：
  
  北京航空航天大学航空科学与工程学院
- 作者简介：
- 基金信息：
- DOI：
  CLC：
- Online First：05 October 2010，
  
  Published：05 October 2010
- 稿件说明：
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WU Bin, XING Yuming, XU Weiqiang. Numerical investigation of electronic thermal control unit with foam composite phase change material[J]. CIESC Journal, 2010, (10): 2540-2545.
DOI：

WU Bin, XING Yuming, XU Weiqiang. Numerical investigation of electronic thermal control unit with foam composite phase change material[J]. CIESC Journal, 2010, (10): 2540-2545. DOI：

摘要

将相变材料（PCM）应用于移动电子设备热控制单元（TCU）是一种极为理想的被动式热设计方案，但因PCM导热率低， TCU热性能较差，需强化PCM的导热以提高TCU的热性能。对填充泡沫复合相变材料（FCPCM）的TCU建立了二维数学模型，并对TCU的热性能进行了计算分析。其中，FCPCM的传热模型考虑了空穴的影响;PCM相变过程采用等效热容法求解。对填充FCPCM的TCU设计和加肋设计进行了比较分析，此外，还分析了泡沫孔隙率、热源功率以及泡沫骨架材料对TCU热性能的影响。结果表明，填充铝制FCPCM极大提高了TCU的热性能，可以很好地满足电子元件热控制设计要求。

Abstract

Due to the advantage of large latent heat and isothermal behavior during the phase change process

solid-liquid phase change material (PCM)can be well applied in the passive thermal design for thermal control unit (TCU)of portable electronic devices.However

PCM has a major drawback of low thermal conductivity

leading to low charging and discharging rates and bad TCU performance.Therefore

it is necessary to enhance the PCM conductivity to improve the TCU thermal performance.A two-dimension mathematical model of TCU filled with foam-PCM composite material (FCPCM)was presented

and numerical simulation was conducted to analyze the TCU thermal performance.The effect of void was considered in the numerical model for FCPCM heat transfer and equivalent capacity method was used to handle PCM phase change process.The thermal performance of TCU filled with FCPCM was compared to that with fins.Further

the effects of some important parameters on TCU thermal performance were investigated numerically

such as foam porosity

heat source power and foam matrix material.The results show that the FCPCM with aluminum matrix can greatly improve the TCU performance

and the design can provide a reliable solution to electronic thermal control.

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