Temperature and thermal stress analysis in membrane wall gasifier under varied work conditions
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Temperature and thermal stress analysis in membrane wall gasifier under varied work conditions
CIESC JournalIssue 10, Pages: 2568-2575(2009)
作者机构:
华东理工大学煤气化教育部重点实验室
作者简介:
基金信息:
DOI:
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Online First:05 October 2009,
Published:05 October 2009
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LIN Weining, LIANG Qinfeng, LIU Haifeng, et al. Temperature and thermal stress analysis in membrane wall gasifier under varied work conditions[J]. CIESC Journal, 2009, (10): 2568-2575.
DOI:
LIN Weining, LIANG Qinfeng, LIU Haifeng, et al. Temperature and thermal stress analysis in membrane wall gasifier under varied work conditions[J]. CIESC Journal, 2009, (10): 2568-2575.DOI:
Temperature and thermal stress analysis in membrane wall gasifier under varied work conditions
Gasification experiment was performed in a bench-scale membrane wall entrained-flow gasifier and the work conditions were altered during the process.A two-dimensional model for the membrane wall was established to simulate the temperature and thermal stress changes.Results indicated that both the circumferential and the radial stress increases with the temperature rising in the membrane wall and slag layer
and the circumferential stress is relatively greater than the radial one.On the interface of slag and silicon carbide layer
the equivalent stress increases rapidly and then reaches to a steady state with the distance from the selected node to the water tube and the slag nail.Significant difference in the equivalent stress was observed for different materials.