ANALYSIS OF EFFECT OF SOLID-LIQUID CONTACT ANGLE ON HEAT TRANSFER ENHANCEMENT OF FILMWISE CONDENSATION
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ANALYSIS OF EFFECT OF SOLID-LIQUID CONTACT ANGLE ON HEAT TRANSFER ENHANCEMENT OF FILMWISE CONDENSATION
CIESC JournalIssue 6, Pages: 850-853(2003)
作者机构:
大连理工大学化学工程研究所
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Online First:25 June 2003,
Published:25 June 2003
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MA Xuehu, CHEN Xiaofeng. ANALYSIS OF EFFECT OF SOLID-LIQUID CONTACT ANGLE ON HEAT TRANSFER ENHANCEMENT OF FILMWISE CONDENSATION[J]. CIESC Journal, 2003, (6): 850-853.
DOI:
MA Xuehu, CHEN Xiaofeng. ANALYSIS OF EFFECT OF SOLID-LIQUID CONTACT ANGLE ON HEAT TRANSFER ENHANCEMENT OF FILMWISE CONDENSATION[J]. CIESC Journal, 2003, (6): 850-853.DOI:
ANALYSIS OF EFFECT OF SOLID-LIQUID CONTACT ANGLE ON HEAT TRANSFER ENHANCEMENT OF FILMWISE CONDENSATION
In order to study the influence of solid-liquid interfacial energy on the filmwise condensation heat transfer performance
a correlation relating heat transfer coefficient with contact angle was derived with respect to liquid film flow and heat transfer at vapor-liquid interface. The calculated results for steam filmwise condensation indicated that heat transfer coefficient increased with increasing contact angle when the contact angle was within a certain range. When contact angle was very small (approaching 0°)
the predicted heat transfer coefficient was consistent with the result of classic Nusselt theory.